Farsince High-Speed Interconnect Cables are engineered for modern data-center, cloud, AI/HPC and storage fabrics where port density, thermal headroom, and eye-diagram margin decide uptime. The portfolio spans external high-speed links (DAC/AEC, AOC) and internal high-speed I/O (Mini SAS families, PCIe cabled links, ultra-thin internal harnesses), covering today’s 100G/200G/400G/800G deployments and roadmap alignment to 1.6T architectures. Designs are tuned to the relevant IEEE/PCI-SIG/MSA/SFF specifications while balancing loss budget, EMI, bend-radius and serviceability.
We support mainstream pluggables—SFP/SFP28/SFP56, QSFP/QSFP28/QSFP56, QSFP-DD, OSFP—plus internal storage/compute interfaces such as Mini SAS / Mini SAS HD, SlimSAS, OCuLink, MCIO. Copper assemblies emphasize controlled impedance, shield topology and gauge discipline; active copper (AEC) adds DSP/redriver for extended reach at low power and latency. Optical assemblies (AOC) reduce bulk and simplify routing for high-density racks while remaining immune to EMI.
For platform engineers, Farsince offers application-specific tuning: gauge and pair geometry selection, thermal/airflow-aware overmolds, ultra-thin/flat constructions for space-constrained chassis, and compliance-oriented test/GR&R processes (IL/RL/SNDR/CM/EMI). Manufacturing across China/Vietnam enables scalable delivery and BOM stability. Result: predictable links from ToR/leaf-spine to accelerator shelves—ready for today’s 400G/800G rollouts and 1.6T transitions.