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13 Years of Expertly Engineered Cable Solutions By FARSINCE.

800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(1)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(2)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(3)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(4)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(5)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(6)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(1)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(2)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(3)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(4)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(5)
800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC(6)

800G OSFP Finned‑Top to 2×400G OSFP Flat‑Top Passive DAC

Breaks out one 800G OSFP switch port to two 400G OSFP NIC ports for short in‑rack links.
5.0
Model No.:
FS21I05
Brand:
Farsince / OEM
MOQ:
Negotiable
Trade Term:
EXW / FOB Ningbo
Lead time:
2–4 weeks
Customization:
Supported
Sample:
Available
Warranty:
1 Year
design customization

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    Description

    Farsince 800G OSFP‑to‑2×OSFP breakout DAC is a copper twinax assembly that fans out a single finned‑top OSFP‑800G port into two independent 400G OSFP flat‑top interfaces. The OSFP end carries eight 100G PAM4 lanes (800GAUI‑8) mapped as dual 4‑lane 400G links for server or accelerator adapters. It is used to connect high‑density 800G switches to two 400G endpoints in spine‑leaf fabrics, AI/ML clusters and scale‑out storage where reach is short and deterministic latency is required.


    The passive design introduces virtually no latency and consumes only identification/management power. Controlled‑impedance 26 AWG pairs with full shielding and a durable braided sleeve maintain low insertion loss and crosstalk, while a 72 mm minimum bend radius supports neat routing in crowded racks. The finned‑top OSFP housing suits cages with riding heat sinks; the 400G ends use flat‑top OSFP for dense front panels. The assembly is hot‑pluggable and interoperable with OSFP MSA mechanics, IEEE 802.3ck signaling and CMIS 4.0 management. Farsince offers platform coding, alternative lengths and labeling with batch test reports for project deployment.



    Specifications

    • Product Type: Passive Direct Attach Copper Breakout Twinax
    • Host Interface: OSFP 800G, finned‑top
    • Device Interface: 2× OSFP 400G, flat‑top
    • Data Rate: 800 Gbps aggregate; 2× 400 Gbps legs
    • Modulation: 8×100G PAM4 to dual 4×100G PAM4
    • Wire Gauge: 26 AWG
    • Cable Structure: Shielded twinax with braided sleeving, Y‑breakout
    • Minimum Bend Radius: 72 mm
    • Jacket Material: PET braided sleeve
    • Power Design: Passive; ≤0.1 W per end for ID/CMIS
    • Operating Temperature: 0 to +70°C
    • Installation: Hot‑pluggable pull‑tab latches; riding‑heat‑sink compatible
    • Compatibility: OSFP MSA Rev 5.0, IEEE 802.3ck, CMIS 4.0
    • Compliance: RoHS, REACH
    • Customization: Vendor coding, length and labeling options
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