Description

Farsince 200G QSFP56 passive direct‑attach copper (DAC), 30AWG twinax assembly for high‑density 200GbE links. Integrating two hot‑pluggable QSFP56 modules, it transports four 50G PAM4 lanes for an aggregate 200 Gbps without separate optics. The cable is intended for in‑rack or adjacent‑rack connections between QSFP56 switches, GPU nodes and servers, supporting AI training clusters, HPC fabrics and data‑center spine/leaf topologies where low latency and predictable behavior are required.

With no active components, the passive design adds virtually no latency and draws only about 0.03 W per end. Controlled‑impedance copper pairs, robust shielding and tight pair skew keep insertion loss and crosstalk low, while a 39 mm minimum bend radius enables neat routing in dense panels. Each assembly is interoperability‑tested and follows QSFP56 MSA mechanics and IEEE 802.3cd 200GBASE‑CR4 electrical specifications. Farsince supports multi‑vendor coding (including NVIDIA/Mellanox profiles), custom lengths, labeling and documented batch testing to match project and maintenance needs.

Specifications

• Product Type: 200G Passive Direct Attach Copper (DAC)
• Connector Type: QSFP56 to QSFP56
• Data Rate: 200 Gbps aggregate (4×50G PAM4)
• Wire Gauge: 30 AWG
• Cable Structure: Shielded twinax, passive
• Minimum Bend Radius: 39 mm
• Power Consumption: ≤0.03 W per end
• Application: 200GbE switch‑to‑switch/server, AI/HPC and data‑center fabrics
• Installation: Hot‑pluggable modules with pull‑tab latches
• Operating Temperature: 0 to +70°C
• Compatibility: IEEE 802.3cd 200GBASE‑CR4; QSFP56 MSA; SFF‑8665 cage; SFF‑8636 memory map
• Jacket Material: PVC (OFNR)
• Compliance: RoHS, REACH
• Customization: Vendor coding, length and label options; test reports