Next-Gen Data Center Interconnect
Next-Gen Data Center Interconnect
1.6T-Ready Architecture for AI Training Clusters & Extreme East-West Traffic
AI-driven data centers are rapidIy evoIving beyond traditionaI cIoud workIoads. Large-scaIe AI training and inference generate unprecedented east–west
traffic between GPUs, acceIerators, switches, and storage systems—driving network fabrics from 400G and 800G toward 1.6T.
FarsinceIs Next-Gen Data Center Interconnect Solution deIivers a future-
proof physical layer, enabIing scaIabIe bandwidth growth without disruptive re-cabIing. It is engineered specificaIIy for Data Center & AI environments
where Iatency, density, and Iong-term scaIabiIity are mission-criticaI.
Architecture Overview
From AI Server Nodes to 1.6T Fabric
Farsince applies a layered interconnect architecture that aligns physical connectivity with AI workload behavior:
1. Inside the AI Server / Node
High-speed internal connections between GPUs, NICs, accelerators, and storage.
Design priorities include signal integrity, airflow efficiency, and mechanical flexibility under continuous high load.
2. Rack-Level Interconnect (Server ↔ ToR)
Ultra-low-latency, high-density links optimized for GPU pods and top-of-rack switching in AI clusters.
3. Fabric Interconnect (Leaf ↔ Spine / Super-Spine)
A scalable optical backbone carrying massive east–west traffic across rows and zones—forming the foundation for 400G, 800G, and future 1.6T fabrics.
4. Structured Infrastructure & Support
Management networks, power distribution, cable routing, and testing systems that ensure long-term stability and operational efficiency.
Design Principle
Build the physical cabling layer once—then scale bandwidth over time by upgrading active components, not the entire infrastructure.
End-to-End Product Mapping
|
Network Layer |
Typical Distance |
Role in AI Data Center |
Farsince Products |
|
Server Internal |
< 1 m |
GPU-GPU, GPU- NIC, storage paths |
PCI Express Cables, Flat & Flexible Cables, Mini SAS Cables |
|
Rack-Level |
1-5 m |
Low-latency server- to-switch |
DAC / ACC / AEC Cables, AOC Cables |
|
Row / Zone |
5-30 m |
East–west traffic aggregation |
AOC Cables, Transceivers |
|
Fabric Backbone |
30-500 m |
400G-1.6T AI fabric |
MPO/MTP® Cables, Fiber Optic Trunk Cables, ODF |
|
Management & Support |
|
OOB, monitoring, power |
LAN Cables, Patch Panels, Cable Management, Cabinets, PDUs |
Bandwidth Evolution Path: 400G → 800G → 1.6T
|
Network Generation |
Optical Interfaces |
Fiber Density Trend |
Physical Cabling Strategy |
|
400G |
DR4 / FR4 |
Medium |
MPO-based trunks with LC fanouts |
|
800G |
DR8 / 2×FR4 |
High |
Higher-density MPO trunks with tighter loss budgets |
|
1.6T |
DR16 / 4×FR4 (emerging) |
Ultra-high |
Pre-installed high-density MPO trunks + structured ODF |
Key Insight
At 1.6T speeds, success depends not only on optics, but on fiber cleanliness, insertion loss control, polarity management, and structured cabling discipline.
AI-Specific Engineering Considerations
|
AI Requirement |
Physical Layer Impact |
Farsince Design Focus |
|
Massive east–west traffic |
Extreme port density |
MPO/MTP trunk-based architecture |
|
Ultra-low training latency |
Deterministic short links |
DAC / AEC / optimized PCIe |
|
High rack power density |
Airflow & cable congestion |
Flat & Flexible Cables, lightweight AOC |
|
Rapid cluster expansion |
Minimal downtime |
ODF-based structured fiber |
|
24/7 continuous operation |
Stability & reliability |
Signal integrity control, test & tools |
Typical Deployment Scenarios
Scenario A · Single-Rack AI Training Pod
. Internal: PCI Express Cables, Flat & Flexible Cables
. Server 艹 ToR: DAC / ACC
. Support: LAN Cables, Patch Panels, PDUs
Scenario B · Multi-Rack AI Cluster (Leaf–Spine)
Rack-Level: AEC or AOC
. Fabric: Transceivers + MPO/MTP Trunks + ODF
. Expansion: Fiber Patch Cords & Adapters
Scenario C · Upgrade to 1.6T
. Retain existing fiber trunks and ODF
. Upgrade optical modules and switch ports only . No disruption to the physical cabling backbone
Why Farsince
. End-to-End Connectivity Portfolio spanning copper, optical, and infrastructure layers
. AI-Optimized Engineering focused on latency, density, airflow, and scalability
. 1.6T-Ready Cabling Strategy aligned with next-generation optics
. Lower Upgrade Risk through structured, standards-based deployment
Call to Action
Build a 1.6T-Ready AI Data Center
Talk to a Farsince engineer to design a future-proof data center interconnect —optimized for AI workloads and ready to scale from 400G and 800G to 1.6T.
Talk to Our Engineer About Your Data Center Interconnect Needs
