Space—not bandwidth—is often the first constraint inside modern servers. Farsince High-Speed Internal IO harnesses use ultra-thin, flat and high-flex constructions to route high-speed signals through cramped volumes while preserving eye margin. Typical use cases include board-to-board/board-to-panel links, mezzanine jumpers, NVMe backplane tails, and accelerator module pigtails.
We optimize pair geometry, dielectric selection, shield layering and adhesive films so the cable can fold cleanly around heat sinks and structural members without micro-cracks or impedance discontinuities. Heads can be low-profile, right-angle or blind-mate, with strain-relief tuned to expected service cycles. Assemblies are characterized for IL/RL, skew, flex endurance and thermal soak.
Options mirror your mechanical reality: custom length/stack-ups, adhesive-backed flat sections, service loops, and color/serial schemes to match bay maps. For platform teams wrestling with airflow, these harnesses open channels that round cables block—improving thermals and serviceability as you scale from 400G nodes toward 800G fabrics and denser 1.6T chassis plans.