Description

This assembly is a low‑profile internal copper cable built around the SFF‑TA‑1002 “Gen‑Z style” connector on both ends. It provides a direct board‑level interconnect between cards, backplanes and mid‑planes inside servers, storage enclosures and HPC nodes. The ribbon‑style, shielded construction supports high‑speed differential signaling with controlled impedance and short internal routing, making it suitable for chassis links carrying Gen‑Z or other protocols implemented over the SFF‑TA‑1002 interface. Typical uses include adapter‑to‑backplane connections, node aggregation inside dense racks, and switch or accelerator modules.

Specifications

• Product Type: Internal high‑speed copper cable assembly
• Host Interface: SFF‑TA‑1002 (Gen‑Z style)
• Device Interface: SFF‑TA‑1002 (both ends)
• Cable Direction: Point‑to‑point
• Application: Server, storage, switch, HPC chassis interconnect
• Data Rate: Per host protocol over SFF‑TA‑1002
• Protocol Support: Gen‑Z, PCIe/CXL, SAS, Ethernet (as designed)
• Conductor: Fine‑gauge copper, shielded ribbon construction
• Cable Length: Custom lengths on request
• Cable Structure: Low‑profile ribbon with pull‑tab, latch retention
• Power Design: Passive copper
• Installation: Tool‑less insertion and service
• Compatibility: Mates with SFF‑TA‑1002 compliant receptacles
• Compliance: RoHS, REACH
• Customization: Length, wiring, tab orientation, ID labels